Reasons for Residual Adhesive in Teflon High Temperature Tape

1. Residues of Teflon high temperature adhesive tape

After the Teflon high temperature tape is baked at high temperature, there will be residual glue, glue overflow and other phenomena. A small amount of residue will be found through close observation. This small amount of residue has a great impact on production.

This phenomenon may be caused by the high temperature resistance data of the Teflon high temperature tape which does not meet the production requirements. Generally, the Teflon high temperature adhesive tape is required to be used in a high temperature environment of 210-260 degrees. Therefore, the Teflon high temperature tape should be confirmed whether it meets the production requirements before production.

2. The temperature of the Teflon high temperature adhesive tape production line is too high

If the temperature of the production line is too high (not within the scope of the process requirements), there will also be adhesive residues from the Teflon high temperature tape. Please check whether the temperature sensor is normal.

Or Teflon high temperature tape itself has quality problems. If the pressure-sensitive adhesive is not heated and cured strictly in accordance with the baking data of the pressure-sensitive adhesive during the coating production process, the curing time is not enough or the coating line speed is too fast, which will cause adhesion, and the glue and the substrate cannot be used in combination.

Since the Teflon high temperature adhesive tape is applied by the glue roller of the coating machine, the semi-finished products generally only need to be placed for 2-3 days after the rewinding and cutting, mainly for bonding the glue to the substrate and curing the glue in a natural state. If it is not completely cured, rewind cutting is performed, and residual gum will appear.

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